Potato Wafer Cutting and Slicing (Semi Auto)

Available with us is a vast range of Potato Wafer Cutting & Slicing (Semi Auto) that is ideal for cutting slices of potato after peeling the same.

These are provided with special alloy steel cutter that is arranged in cycle to slice potatoes evenly and rapidly. Our machines work automatically by a ½ H.P. electric motor and have their unit mounted on a steel stand of comfortable height to enable the operator to attend the machine conveniently.